Micron Booth at 3rd CISCE in Beijing

BEIJING, CHINA - JULY 20, 2025 - Modules with packaged memory chips displayed at Micron's booth at the 3rd China International Supply Chain Expo in Beijing, China on July 20, 2025. (Photo credit should read CFOTO/Future Publishing via Getty Images)

Micron Booth at 3rd CISCE in Beijing
BEIJING, CHINA - JULY 20, 2025 - Modules with packaged memory chips displayed at Micron's booth at the 3rd China International Supply Chain Expo in Beijing, China on July 20, 2025. (Photo credit should read CFOTO/Future Publishing via Getty Images)
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來源: CFOTO / Contributor

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編輯性內容編號：
2225258760
圖像集:
Future Publishing
建立日期：
2025年07月20日
上傳日期：
授權類型：
權利管理
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無許可授權 更多資料
來源：
Future Publishing
物件名稱：
Micron Booth at 3rd CISCE in Beijing
最大檔案大小：
4248 x 2832 像素 (35.97 x 23.98 cm) - 300 dpi - 3 MB